Budujesz sterowniki, napędy albo moduły I/O do maszyn, które nie mogą stać? Zmontujemy ich elektronikę powtarzalnie: od pierwszej sztuki po serię, z kontrolą każdej płyty.Building controllers, drives or I/O modules for machines that cannot stand still? We'll assemble their electronics repeatably: from the first unit to series production, with every board inspected.
[ Anatomia sterownikaController anatomy ]
Sterownik, napęd, moduł wejść i wyjść, panel operatora. Zanim linia ruszy, ktoś musi zmontować elektronikę. Powtarzalnie, od prototypu po serię.A controller, a drive, an I/O module, an operator panel. Before a line starts up, someone has to assemble the electronics. Repeatably, from prototype to series production.
[ 01 / 04 ] KomunikacjaCommunication
Układy komunikacyjne w obudowach QFN, fine-pitch, tuż obok gniazd sieciowych. Raster 0,5 mm montujemy standardowo, 0,4 mm po dodatkowej walidacji.Communication ICs in fine-pitch QFN packages, right next to the network sockets. We place a 0.5 mm pitch as standard and 0.4 mm after additional validation.
[ 02 / 04 ] SterowanieControl
Procesor w BGA 0,5 mm, wokół pasywne 0201 i 01005. Połączenia ukryte pod obudową sprawdzamy na X-Ray.A processor in a 0.5 mm BGA, surrounded by 0201 and 01005 passives. Joints hidden under the package are checked by X-ray.
[ 03 / 04 ] Wejścia i wyjściaInputs and outputs
Przekaźniki, transoptory i złącza śrubowe obok drobnych układów. SMT i THT na jednej płytce, u jednego wykonawcy.Relays, optocouplers and screw terminals next to small ICs. SMT and THT on a single board, with one contractor.
[ 04 / 04 ] ZasilaniePower
Transformatory, kondensatory i elementy mocy osadzamy w otworach: ręcznie oraz selektywnie na ERSA Versaflow. Płytki do 460 × 380 mm.Transformers, capacitors and power components go through-hole: soldered manually and selectively on an ERSA Versaflow. Boards up to 460 × 380 mm.
[ ZakresScope ]
Techbit to producent kontraktowy (EMS). Pracujemy na Twojej dokumentacji i według Twoich wymagań.Techbit is a contract manufacturer (EMS). We work from your documentation and to your requirements.
[ Gdzie pracuje ta elektronikaWhere these electronics work ]
/Szafy sterowniczeControl cabinets
/Linie produkcyjneProduction lines
/RobotykaRobotics
We don't just promise quality. We measure it and share the results.
BGA and through-hole parts, quality, component shortages, repeat batches, complaints and certificates.
Yes. Hanwha Decan S1 and L1 pick-and-place machines place components from 01005, 0.5 mm BGAs and ICs up to 55 mm. Connectors and power components are soldered manually and selectively on an ERSA Versaflow, on the same board.
We perform AOI off-line, on a separate machine (Mirtec MV-3U), and use off-line X-ray inspection for QFN and BGA packages (FocalSpot). We do not have SPI. Functional testing is included once you supply the tester and instructions.
We review the BOM, component availability and alternative sources, and buy only after your approval. In the BOM, identify critical items, components without approved substitutes, and sourcing requirements. We cannot guarantee the availability or lead time of every item in advance.
Every repeat order is based on the current design revision. Before the next batch, we review what has changed in the design and whether it affects the cost or lead time. There is no need to set up the project again from scratch.
We respond within 24 h and present a corrective action plan within 5 business days. These are commitments we take on and show alongside FPY and on-time delivery.
ISO 9001:2015. Requirements beyond that standard, such as industry standards for industrial automation or product documentation, are discussed before the quote. If we cannot fully support something, we say so at the start.
BOM, Gerber files and Pick&Place data are enough. We answer phone calls the same day and emails within 24 h.