Implementation of an innovative SMD assembly service using proprietary technology for laser-based removal of markings from sensitive components

The project aims to purchase and commission an SMD assembly line equipped with a laser system for removing component markings. Once implemented, we will offer SMD assembly with the option to remove markings from selected components at the customer's request. This makes the device's architecture harder to identify and copy.

• Purchase of an SMD assembly line with a laser system for component marking removal.
• Connecting the line to existing machinery: solder paste printer, reflow oven, and loader and unloader stations. Automated optical inspection (AOI) takes place off-line, on a separate machine.
• Launching production with a new process: laser marking removal, surface mounting, soldering, and testing.

• Companies looking for high-quality SMD assembly that also want to make their devices harder to copy.
• TECHBIT employees operating the new line.

• New service: SMD assembly with laser removal of markings from selected components.
• Increased assembly efficiency (from 12,000 to 45,000 components per hour) and higher precision (±50 µm).
• Reduced line changeover time (from approx. 4 hours to approx. 20 minutes), resulting in lower energy consumption per board.